Welcome to FLP Microfinishing GmbH - Your expert for precision grinding, lapping and polishing

Welcome to FLP Microfinishing GmbH
Your expert for precision grinding, lapping and polishing

Service-Hotline

+49 (0) 34956 / 397-0

Email-Support

info@flp-microfinishing.de

CMP polishing

Chemical-mechanical planarization is a polishing method in the optical and semi-conductor industry (wafer machining) which is used to evenly remove thin layers. The basic principle functions predominantly with crystalline materials. By dissolving the surface using the chemical components of the slurry (suspension), it is possible to smooth the surface or to remove it using the mechanical components (abrasive) without causing new sub-surface damage in the process. CMP is among the key technologies which make the realisation of state-of-the-art microelectronic components and micro electromechanical system (MEMS) possible at all.